US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 30 for "Semiconductor device with conductive liners over silicide structures and method of making the semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,433,006, issued on Sept. 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device with conductive liners over silicide structures and method of making the semiconductor device" was invented by Kuan-Kan Hu (Hsinchu, Taiwan), Shuen-Shin Liang (Hsinchu, Taiwan), Chia-Hung Chu (Hsinchu, Taiwan), Po-Chin Chang (Hsinchu, Taiwan), Hsu-Kai Chang (Hsinchu, Taiwan), Ken-Yu Chang (Hsinchu, Taiwan), Wei-Yip Loh (Hsinchu, Taiwan), Hung-Yi Huang (Hsinchu, Taiwan), Harry Chien (Hsinchu, Taiwan), Sung-Li Wang (Hsinchu, Taiwan), Pinyen Lin (Hsinchu, Taiwan), Chuan-Hui Shen (Hsinchu, Taiwan), Tzu-Pei Chen (Hsinchu, Taiwan) and Yuting Cheng (Hsinchu, ...