US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 30 for "Semiconductor device with backside power rail" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,975, issued on Sept. 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device with backside power rail" was invented by Pei-Yu Wang (Hsinchu, Taiwan), Yu-Xuan Huang (Hsinchu, Taiwan), Huan-Chieh Su (Changhua County, Taiwan), Chun-Yuan Chen (HsinChu, Taiwan) and Li-Zhen Yu (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of fabricating a semiconductor device includes providing a dummy structure including channel layers disposed over a frontside of a substrate, inner spacers disposed between adjacent channels of the channel layers and at lateral ends of the channel layers,...