US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 30 for "Polishing pad conditioning apparatus" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,427,622, issued on Sept. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).

"Polishing pad conditioning apparatus" was invented by Cheng-Ping Chen (Taichung, Taiwan), Shih-Chung Chen (Hsinchu, Taiwan), Sheng-Tai Peng (Miaoli County, Taiwan) and Hung-Lin Chen (Pingtung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing pad conditioning apparatus includes a base, a fiber, and a polymer protruding from a surface of the base and encompassing the fiber."

The patent was filed on April 3, 2023, under Application No. 18/130,267.

*For further information, including images, charts and tables, please visit: http:...