US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 30 for "Packages with enlarged through-vias in encapsulant" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,400, issued on Sept. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Packages with enlarged through-vias in encapsulant" was invented by Hung-Jui Kuo (Hsinchu, Taiwan), Tai-Min Chang (Taipei, Taiwan), Hui-Jung Tsai (Hsinchu, Taiwan), De-Yuan Lu (Taipei, Taiwan) and Ming-Tan Lee (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes a device die, an encapsulant encapsulating the device die therein, a first plurality of through-vias penetrating through the encapsulant, a second plurality of through-vias penetrating through the encapsulant, and redistribution lines over and electrically...