US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 30 for "Package structure having trench capacitor" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,444, issued on Sept. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure having trench capacitor" was invented by Fu-Chiang Kuo (Hsinchu, Taiwan) and Jen-Yuan Chang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure comprises a semiconductor substrate, a first trench capacitor, and a second trench capacitor. The substrate has first trenches arranged in a first arrangement direction with each first trench extending in a first extension direction and second trenches arranged in a second arrangement direction with each second trench extending in a second extension...