ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,446, issued on Sept. 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).
"Package structure" was invented by Chih-Hsuan Tai (Taipei, Taiwan), Ting-Ting Kuo (Hsinchu, Taiwan), Yu-Chih Huang (Hsinchu, Taiwan), Chih-Wei Lin (Hsinchu County, Taiwan), Hsiu-Jen Lin (Hsinchu County, Taiwan), Chih-Hua Chen (Hsinchu County, Taiwan), Ming-Da Cheng (Taoyuan, Taiwan), Ching-Hua Hsieh (Hsinchu, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan) and Chung-Shi Liu (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a semiconductor device, a molding compound, a first dielectric layer, and a through-via. T...