US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 30 for "Method for low-cost, high-bandwidth monolithic system integration beyond reticle limit" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,423, issued on Sept. 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method for low-cost, high-bandwidth monolithic system integration beyond reticle limit" was invented by Murat Kerem Akarvardar (Hsinchu, Taiwan) and Hon-Sum Philip Wong (Stanford, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor monolithic IC includes a semiconductor substrate having a rectangular shape in plan view, multiple chiplets each comprising a circuit, wherein the multiple chiplets are disposed over the semiconductor substrate and are separated from each other by die-to-die spaces filled with a dielectric materi...