US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 30 for "Method for forming structure of pellicle-mask structure with vent structure" (Taiwanese Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,429,760, issued on Sept. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method for forming structure of pellicle-mask structure with vent structure" was invented by Yun-Yue Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a structure of a pellicle-mask structure is provided. The method includes forming a mask pattern on a mask substrate. The method also includes bonding a pellicle frame to the mask pattern through a pellicle frame adhesive. The method further includes forming a vent structure in the pellicle frame. In addition, the method includes bonding a pellicle membrane t...