US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 30 for "Integrated circuits and methods for power delivery" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,428, issued on Sept. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuits and methods for power delivery" was invented by Ming Chian Tsai (Hsinchu, Taiwan), Shih-Wei Peng (Hsinchu, Taiwan), Wei-Cheng Lin (Taichung, Taiwan) and Jiann-Tyng Tzeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit includes a first power rail, a second power rail, and a power tap cell. The first power rail is at a first side of the integrated circuit. The second power rail is at a second side of the integrated circuit. The first and second sides are on opposite sides of at least a comp...