US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 30 for "Fan-out packages providing enhanced mechanical strength and methods for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,467, issued on Sept. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Fan-out packages providing enhanced mechanical strength and methods for forming the same" was invented by Jen-Yuan Chang (Hsinchu, Taiwan) and Chia-Ping Lai (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An array of complementary die sets is attached to a carrier substrate. A continuous complementary-level molding compound layer is formed around the array of complementary die sets. An array of primary semiconductor dies is attached to the array of complementary die sets. A continuous primary-level molding compound layer is forme...