US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 30 for "Device having an air gap adjacent to a contact plug and covered by a doped dielectric layer" (Taiwanese, Singaporean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,963, issued on Sept. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Device having an air gap adjacent to a contact plug and covered by a doped dielectric layer" was invented by Su-Hao Liu (Jhongpu Township, Taiwan), Kuo-Ju Chen (Taichung, Taiwan), Kai-Hsuan Lee (Hsinchu, Taiwan), I-Hsieh Wong (Hsinchu, Taiwan), Cheng-Yu Yang (Xihu Township, Taiwan), Liang-Yin Chen (Hsinchu, Taiwan), Huicheng Chang (Tainan, Taiwan), Yee-Chia Yeo (Singapore), Syun-Ming Jang (Hsinchu, Taiwan) and Meng-Han Chou (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device includes a fin extending from a semiconductor subs...