US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 30 for "Conductive structure interconnects with downward projections" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,431, issued on Sept. 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Conductive structure interconnects with downward projections" was invented by Tzu Pei Chen (Taipei, Taiwan), Chia-Hao Chang (Hsinchu, Taiwan), Shin-Yi Yang (Taipei, Taiwan), Chia-Hung Chu (Taipei, Taiwan), Po-Chin Chang (Taichung, Taiwan), Shuen-Shin Liang (Hsinchu, Taiwan), Chun-Hung Liao (Taichung, Taiwan), Yuting Cheng (Taoyuan, Taiwan), Hung-Yi Huang (Hsinchu, Taiwan), Harry Chien (Chandler, Ariz.), Pinyen Lin (Rochester, N.Y.) and Sung-Li Wang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are devices with cond...