US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 30 for "Chemical-mechanical planarization pad and methods of use" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,427,618, issued on Sept. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Chemical-mechanical planarization pad and methods of use" was invented by Te-Chien Hou (Kaohsiung, Taiwan), Chih Hung Chen (Hsinchu, Taiwan), Shich-Chang Suen (Hsinchu, Taiwan), Liang-Guang Chen (Hsinchu, Taiwan), Wen-Pin Liao (Hsinchu, Taiwan) and Kei-Wei Chen (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some implementations described herein relate to dispensing a slurry onto a polishing pad for a chemical-mechanical planarization (CMP) process. These implementations also involve rotating the polishing pad while the slurry is ...