US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 30 for "Buffer block structures for C4 bonding and methods of using the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,415, issued on Sept. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Buffer block structures for C4 bonding and methods of using the same" was invented by Li-Ling Liao (Hsinchu, Taiwan), Ming-Chih Yew (Hsinchu, Taiwan), Chia-Kuei Hsu (Hsinchu, Taiwan), Po-Yao Lin (Zhudong Township, Taiwan) and Shin-Puu Jeng (Po-Shan Village, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a fan-out package comprising at least one semiconductor die, a redistribution structure including fan-out bonding pads, and a first underfill material portion located between the at least one semiconducto...