US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 23 for "Three-dimensional (3D) package" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,562, issued on Sept. 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Three-dimensional (3D) package" was invented by Wei-Yu Chen (Hsinchu, Taiwan), Chun-Chih Chuang (Taichung, Taiwan), Kuan-Lin Ho (Hsinchu, Taiwan), Yu-Min Liang (Zhongli, Taiwan) and Jiun Yi Wu (Zhongli, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes an interposer structure free of any active devices. The interposer structure includes an interconnect device; a dielectric film surrounding the interconnect device; and first metallization pattern bonded to the interconnect device. The package further includes a first device...