US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 23 for "Semiconductor packages with through via structures and methods for testing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,422,470, issued on Sept. 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor packages with through via structures and methods for testing the same" was invented by Ying-Chih Hsu (Hsinchu, Taiwan), Jui-Cheng Huang (Hsinchu, Taiwan), Mu Wei Lee (Hsinchu, Taiwan) and Wei-Tao Shaw (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes an array of through-substrate-via (TSV) structures comprising a number (O) of TSV structures, wherein the array comprises a number (M) of active TSV structures; a number (N) of contact structures, the contact structures comprising a plural...