US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 23 for "Semiconductor device with inductive component and method of forming" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,426,284, issued on Sept. 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device with inductive component and method of forming" was invented by Mei-Chi Lee (Tainan, Taiwan), Chi-Cheng Chen (Tainan, Taiwan), Wei-Li Huang (Pingtung, Taiwan), Kai Tzeng (Neipu, Taiwan), Chun Yi Wu (Tainan, Taiwan) and Ming-Da Cheng (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor device includes: forming a passivation layer over a conductive pad that is disposed over a substrate; and forming an inductive component over the passivation layer, including: forming a first insul...