US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 23 for "Semiconductor device with back-side via structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,520, issued on Sept. 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device with back-side via structure" was invented by Ta-Chun Lin (Hsinchu, Taiwan) and Jhon-Jhy Liaw (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a transistor structure disposed on a first side of a substrate and a back-side via structure disposed on a second side of the substrate opposite to the first side. The transistor structure includes a pair of epitaxial structures and a channel feature extending in a channel length direction to be disposed between the epitaxial structur...