US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 23 for "Passivation scheme for pad openings and trenches" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,573, issued on Sept. 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Passivation scheme for pad openings and trenches" was invented by Ming-Hong Chang (Hsin-Chu, Taiwan), Chun-Yi Yang (Hsinchu, Taiwan), Kun-Ming Huang (Taipei, Taiwan), Po-Tao Chu (New Taipei, Taiwan), Shen-Ping Wang (Keelung, Taiwan) and Chien-Li Kuo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) comprising an enhanced passivation scheme for pad openings and trenches is provided. In some embodiments, an interlayer dielectric (ILD) layer covers a substrate and at least partially defines a trench. The tre...