US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 23 for "Package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,571, issued on Sept. 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure and manufacturing method thereof" was invented by Sen-Kuei Hsu (Kaohsiung, Taiwan) and Hsin-Yu Pan (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a first redistribution circuit structure, a second redistribution circuit structure, a semiconductor die, a waveguide structure, and an antenna. The semiconductor die is sandwiched between and electrically coupled to the first redistribution circuit structure and the second redistribution circuit structure. The waveguide structure is locate...