US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 23 for "Manufacturing method of semiconductor structure and semiconductor structure thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,499, issued on Sept. 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Manufacturing method of semiconductor structure and semiconductor structure thereof" was invented by Pei-Lum Ma (Taipei, Taiwan), Kun Da Jhong (Tainan, Taiwan), Hsueh-Han Lu (Tainan, Taiwan), Kun-Ei Chen (Tainan County, Taiwan), Chen-Chieh Chiang (Kaohsiung, Taiwan) and Ling-Sung Wang (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure is provided. The semiconductor structure includes an interconnection structure, a first conductive pad, a second conductive pad, a conductive material and a conductive coil...