US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 23 for "Integrated circuit package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,576, issued on Sept. 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit package and method" was invented by Wen-Chih Chiou (Zhunan Township, Taiwan), Chen-Hua Yu (Hsinchu, Taiwan), Shih Ting Lin (Taipei, Taiwan) and Szu-Wei Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a device includes: an interposer; a first integrated circuit device bonded to the interposer with dielectric-to-dielectric bonds and with metal-to-metal bonds; a second integrated circuit device bonded to the interposer with dielectric-to-dielectric bonds and with metal-to-metal bonds; a buffer...