US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 23 for "Integrated circuit having angled conductive feature" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,426,380, issued on Sept. 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Integrated circuit having angled conductive feature" was invented by Tung-Heng Hsieh (Hsinchu, Taiwan), Ting-Wei Chiang (Hsinchu, Taiwan), Chung-Te Lin (Hsinchu, Taiwan), Hui-Zhong Zhuang (Hsinchu, Taiwan), Li-Chun Tien (Hsinchu, Taiwan) and Sheng-Hsiung Wang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit includes a first gate electrode structure extending in a first direction. The integrated circuit includes a second gate electrode structure extending in the first direction and separated in a second di...