US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 23 for "Integrated chip including an upper conductive structure having multilayer stack to decrease fabrication costs and increase performance" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,579, issued on Sept. 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated chip including an upper conductive structure having multilayer stack to decrease fabrication costs and increase performance" was invented by Tzu-Yu Lin (Taoyuan, Taiwan), Yao-Wen Chang (Taipei, Taiwan), Chia-Wen Zhong (Taichung, Taiwan) and Yen-Liang Lin (Yilan County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the present disclosure are directed towards an integrated chip. The integrated chip includes an interconnect structure overlying a semiconductor substrate and comprising a conductive wire. A pa...