US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 23 for "Hybrid bonding with uniform pattern density" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,605, issued on Sept. 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).

"Hybrid bonding with uniform pattern density" was invented by Szu-Ying Chen (Toufen Township, Taiwan) and Dun-Nian Yaung (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip includes a semiconductor substrate, integrated circuits with at least portions in the semiconductor substrate, and a surface dielectric layer over the integrated circuits. A plurality of metal pads is distributed substantially uniformly throughout substantially an entirety of a surface of the chip. The plurality of metal pads has top surfaces level with a to...