US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 23 for "Core-shell nanostructures for semiconductor devices" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,426,322, issued on Sept. 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Core-shell nanostructures for semiconductor devices" was invented by Cheng-Yi Peng (Taipei, Taiwan) and Song-Bor Lee (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The structure of a semiconductor device with core-shell nanostructured channel regions between source/drain regions of FET devices and a method of fabricating the semiconductor device are disclosed. A semiconductor device includes a substrate, a stack of nanostructured layers with first and second nanostructured regions disposed on the substrate, and nanostructured she...