US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 23 for "Bridge die having different surface orientation than IC dies interconnected by the bridge die" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,558, issued on Sept. 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Bridge die having different surface orientation than IC dies interconnected by the bridge die" was invented by Yu-Sheng Lin (Zhubei, Taiwan), Chin-Fu Kao (Taipei, Taiwan), Tsung-Yang Hsieh (Taipei, Taiwan), Jyun-Lin Wu (Hsinchu, Taiwan) and Yao-Chun Chuang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A first integrated circuit (IC) die includes a first substrate. A second IC die includes a second substrate. At least one of the first substrate or the second substrate has a first surface orientation. The first IC die is spac...