US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 23 for "Antenna package for signal transmission" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,730, issued on Sept. 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd..

"Antenna package for signal transmission" was invented by Feng-Wei Kuo (Zhudong Township, Taiwan) and Wen-Shiang Liao (Toufen Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "This application relates to a device for signal transmission (e.g., radio frequency transmission) and a method for forming the device. For example, the method includes: depositing an insulating layer that includes polybenzobisoxazole (PBO) on a carrier; forming a backside layer including polyimide (PI) over the adhesive layer; forming a die-attach film (DAF) over the backside l...