US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 2 for "Integrated circuit package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,406,961, issued on Sept. 2, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit package and method" was invented by Chung-Shi Liu (Hsinchu, Taiwan), Mao-Yen Chang (Kaohsiung, Taiwan), Yu-Chia Lai (Zhunan Township, Taiwan), Kuo-Lung Pan (Hsinchu, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan), Ching-Hua Hsieh (Hsinchu, Taiwan), Hsiu-Jen Lin (Zhubei, Taiwan), Po-Yuan Teng (Hsinchu, Taiwan), Cheng-Chieh Wu (Hsinchu, Taiwan) and Jen-Chun Liao (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit package including electrically floating metal lines and a method of forming are provided. The...