US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 16 for "Thermal sensor device by back end of line metal resistor" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,955, issued on Sept. 16, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Thermal sensor device by back end of line metal resistor" was invented by Yu-Hsiang Chen (Hsinchu, Taiwan), Hsiu-Wen Hsueh (Taichung, Taiwan), Szu-Lin Liu (Hsinchu, Taiwan), Wen-Sheh Huang (Hsin Chu, Taiwan), Chloe Hsin-Yi Chen (Hsinchu, Taiwan) and Wei-Lin Lai (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a substrate having a front side and a back side, one or more dielectric layers over the front side, and a conductive structure. The one or more dielectric layers include a thermal sensor...