US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 16 for "Semiconductor structure and circuit structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,969, issued on Sept. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure and circuit structure" was invented by Kuan-Lin Ho (Hsinchu, Taiwan), Chin-Liang Chen (Kaohsiung, Taiwan), Pei-Rong Ni (Hsinchu, Taiwan), Chia-Min Lin (Hsinchu, Taiwan), Yu-Min Liang (Taoyuan, Taiwan) and Jiun-Yi Wu (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a redistribution structure, conductive joints, conductive terminals, a circuit substrate, and an insulating encapsulation. The redistri...