US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 16 for "Semiconductor package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,005, issued on Sept. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and manufacturing method thereof" was invented by Tzuan-Horng Liu (Taoyuan, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan), Kris Lipu Chuang (Hsinchu, Taiwan) and Hsin-Yu Pan (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package and a manufacturing method are provided. The semiconductor package includes a first die disposed on and electrically coupled to a first redistribution structure and laterally covered by a first insulating encapsulation, a second die disposed over the first die and laterally ...