US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 16 for "Semiconductor die including guard ring structure and three-dimensional device structure including the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,987, issued on Sept. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor die including guard ring structure and three-dimensional device structure including the same" was invented by Jen-Yuan Chang (Hsinchu, Taiwan), Chien-Chang Lee (Hsinchu, Taiwan) and Chia-Ping Lai (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A die includes: a semiconductor substrate; an interconnect structure disposed on the semiconductor substrate and including: inter-metal dielectric (IMD) layers; metal features embedded in the IMD layers; and a guard ring structure including concentric first and second guard ri...