US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 16 for "Semiconductor device and method of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,927, issued on Sept. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and method of manufacture" was invented by Wei-Yu Chen (Taipei, Taiwan), Hao-Jan Pei (Hsinchu, Taiwan), Hsuan-Ting Kuo (Taichung, Taiwan), Chih-Chiang Tsao (Taoyuan, Taiwan), Jen-Jui Yu (Taipei, Taiwan), Philip Yu-Shuan Chung (Taipei, Taiwan), Chia-Lun Chang (Tainan, Taiwan), Hsiu-Jen Lin (Zhubei, Taiwan) and Ching-Hua Hsieh (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming regions of solder paste on a redistribution structure, wherein the solder paste has a first melting temperature; ...