US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 16 for "Package structure and forming method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,968, issued on Sept. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure and forming method thereof" was invented by Chin-Liang Chen (Kaohsiung, Taiwan), Chi-Yang Yu (Taoyuan, Taiwan), Yu-Min Liang (Taoyuan, Taiwan), Hao-Cheng Hou (Hsinchu, Taiwan), Jung-Wei Cheng (Hsinchu, Taiwan) and Tsung-Ding Wang (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure and a manufacturing method thereof are provided. The package structure includes an integrated substrate and a package component. The integrated substrate includes a substrate component laterally covered by an insulating ...