US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 16 for "Method for forming light pipe structure with high quantum efficiency" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,419,124, issued on Sept. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method for forming light pipe structure with high quantum efficiency" was invented by Tsun-Kai Tsao (Tainan, Taiwan), Jiech-Fun Lu (Madou Township, Taiwan), Shih-Pei Chou (Tainan, Taiwan) and Tzu-Ming Wang (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the present disclosure are directed towards an integrated chip including an optical device within or on a semiconductor substrate. A light guide structure overlies the optical device. A first etch stop layer extends along first sidewalls and a lower surface o...