US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 16 for "Method for forming chip package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,970, issued on Sept. 16, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method for forming chip package structure" was invented by Chin-Hua Wang (New Taipei, Taiwan), Chia Kuei Hsu (Hsinchu, Taiwan), Shu-Shen Yeh (Taoyuan, Taiwan), Po-Chen Lai (Hsinchu County, Taiwan), Po-Yao Lin (Zhudong Township, Hsinchu County, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package structure is provided. The chip package structure includes a wiring substrate. The chip package structure includes an interposer substrate over the wiring substrate. The interposer substrate include...