US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 16 for "Integrated circuit, system for and method of forming an integrated circuit" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,332, issued on Sept. 16, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Integrated circuit, system for and method of forming an integrated circuit" was invented by Jung-Chan Yang (Hsinchu, Taiwan), Ting-Wei Chiang (Hsinchu, Taiwan), Cheng-I Huang (Hsinchu, Taiwan), Hui-Zhong Zhuang (Hsinchu, Taiwan), Chi-Yu Lu (Hsinchu, Taiwan) and Stefan Rusu (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit structure includes a first and second power rail on a first level, a first and second set of conductive structures on a second level and a first, second and third conductive structure o...