US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 16 for "Impact-resistant micromechanical arms" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,415,718, issued on Sept. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Impact-resistant micromechanical arms" was invented by Jheng-Hong Jiang (Hsinchu, Taiwan), Shing-Huang Wu (Hsinchu, Taiwan) and Chia-Wei Liu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A micromechanical arm is provided. The micromechanical arm includes: a bottom metal piece having a plurality of trenches extending downwardly from a top surface of the bottom metal piece; an intermediate layer on the bottom metal piece and filling at least a portion of each of the plurality of trenches; and a top metal piece on the intermediate...