US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 16 for "Chip structure with conductive pillar and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,992, issued on Sept. 16, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Chip structure with conductive pillar and method for forming the same" was invented by Shan-Yu Huang (Zhubei, Taiwan), Ming-Da Cheng (Taoyuan, Taiwan), Hsiao-Wen Chung (Taipei, Taiwan), Ching-Wen Hsiao (Hsinchu, Taiwan), Li-Chun Hung (Hsinchu, Taiwan), Yuan-Yao Chang (Kaohsiung, Taiwan) and Meng-Hsiu Hsieh (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip structure is provided. The chip structure includes a substrate. The chip structure includes a first conductive line over the substrate. The chip structure includes an i...