US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 16 for "Chip stack structure with conductive plug and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,991, issued on Sept. 16, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Chip stack structure with conductive plug and method for forming the same" was invented by Chuei-Tang Wang (Taichung, Taiwan), Tso-Jung Chang (Taoyuan, Taiwan), Shih-Ping Lin (Taichung, Taiwan), Jeng-Shien Hsieh (Kaohsiung, Taiwan), Chih-Peng Lin (Hsinchu County, Taiwan), Chieh-Yen Chen (Taipei, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip stack structure is provided. The chip stack structure includes a first chip including a first substrate and a first interconnect structure over the first s...