US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 16 for "3D integrated circuit (3DIC) structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,001, issued on Sept. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).

"3D integrated circuit (3DIC) structure" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Wen-Chih Chiou (Zhunan Township, Taiwan) and Chung-Shi Liu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment bonded integrated circuit (IC) structure includes a first IC structure and a second IC structure bonded to the first IC structure. The first IC structure includes a first bonding layer and a connector. The second IC structure includes a second bonding layer bonded to and contacting the first bonding layer and a contact pad i...