US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 7 for "Staggered metal mesh on backside of device die and method forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,007, issued on Oct. 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Staggered metal mesh on backside of device die and method forming same" was invented by Tzu-Sung Huang (Tainan, Taiwan), Tsung-Hsien Chiang (Hsinchu, Taiwan), Ming Hung Tseng (Toufen Township, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan), Yu-Hsiang Hu (Hsinchu, Taiwan), Chih-Wei Lin (Zhubei, Taiwan), Lipu Kris Chuang (Hsinchu, Taiwan), Wei Lun Tsai (Kaohsiung, Taiwan), Kai-Ming Chiang (Hsinchu, Taiwan), Ching Yao Lin (Taichung, Taiwan), Chao-Wei Li (Hsinchu, Taiwan) and Ching-Hua Hsieh (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A meth...