US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 7 for "Semiconductor structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,003, issued on Oct. 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and manufacturing method thereof" was invented by Li-Wei Chu (New Taipei, Taiwan), Yu-Hsiang Liao (Hsinchu, Taiwan), Hung-Hsu Chen (Tainan, Taiwan), Chih-Wei Chang (Hsin-Chu, Taiwan), Ming-Hsing Tsai (Chu-Pei, Taiwan) and Ying-Chi Su (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and a method for forming a semiconductor structure are provided. The semiconductor structure includes an epitaxial structure and a metal silicide layer. The epitaxial structure includes a semiconductor m...