US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 7 for "Semiconductor patterning and resulting structures" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,437,996, issued on Oct. 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor patterning and resulting structures" was invented by Chun-Ming Lung (Hsinchu, Taiwan) and ChunYao Wang (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes depositing a hard mask over a target layer. Depositing the hard mask includes depositing a first hard mask layer having a first density and depositing a second hard mask layer over the first hard mask layer, the second hard mask layer having a second density greater than the first density. The method further includes forming a plurality of mandrels over t...