US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 7 for "Semiconductor device structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,625, issued on Oct. 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device structure and method for forming the same" was invented by Kan-Ju Lin (Kaohsiung, Taiwan), Chien Chang (Hsinchu, Taiwan), Chih-Shiun Chou (Hsinchu, Taiwan), Tai Min Chang (Taipei, Taiwan), Yi-Ning Tai (Taoyuan, Taiwan), Hong-Mao Lee (Hsinchu, Taiwan), Yan-Ming Tsai (Miaoli, Taiwan), Wei-Yip Loh (Hsinchu, Taiwan), Harry Chien (Hsinchu, Taiwan), Chih-Wei Chang (Hsinchu, Taiwan), Ming-Hsing Tsai (Hsinchu, Taiwan) and Lin-Yu Huang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and metho...