US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 7 for "Seal ring structure and method of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,105, issued on Oct. 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Seal ring structure and method of fabricating the same" was invented by Yen Lian Lai (New Taipei, Taiwan), Chun Yu Chen (Hsinchu, Taiwan), Yen-Sen Wang (Hsinchu, Taiwan) and Chung-Yi Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a substrate; a seal ring region around a circuit region over the substrate, wherein the seal ring region includes a sealing region and a transition region, and wherein the transition region is disposed between the sealing region and the circuit region; and a stack ...