US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 7 for "Redistribution lines with protection layers and method forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,048, issued on Oct. 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Redistribution lines with protection layers and method forming same" was invented by Ming-Da Cheng (Taoyuan, Taiwan), Wen-Hsiung Lu (Tainan, Taiwan), Chin Wei Kang (Tainan, Taiwan), Yung-Han Chuang (Tainan, Taiwan), Lung-Kai Mao (Kaohsiung, Taiwan) and Yung-Sheng Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a metal seed layer over a first conductive feature of a wafer, forming a patterned photo resist on the metal seed layer, forming a second conductive feature in an opening in the patterned photo res...