US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 7 for "Package structures and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,082, issued on Oct. 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structures and method of forming the same" was invented by Chen-Hua Yu (Hsinchu, Taiwan) and An-Jhih Su (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment is a method including forming a first package. The forming the first package includes forming a through via adjacent a first die, at least laterally encapsulating the first die and the through via with an encapsulant, and forming a first redistribution structure over the first die, the through via, and the encapsulant. The forming the first redistribution structu...