US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 7 for "Methods for integrated circuit design and fabrication" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,000, issued on Oct. 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsin-Chu, Taiwan).

"Methods for integrated circuit design and fabrication" was invented by Tsong-Hua Ou (Taipei, Taiwan), Ken-Hsien Hsieh (Taipei, Taiwan), Shih-Ming Chang (Hsinchu County, Taiwan), Wen-Chun Huang (Taipei, Taiwan), Chih-Ming Lai (Hsinchu, Taiwan), Ru-Gun Liu (Hsinchu County, Taiwan) and Tsai-Sheng Gau (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a method of patterning a target material layer over a semiconductor substrate. The method includes steps of forming a spacer feature over the target materi...